Low-loss optical interconnects in hybrid integrated platforms for silicon photonics are likely to become increasingly important to overcome power consumption limitations in telecom packaging applications. Here, we show a short taper device that effectively interconnects electro-optic polymer modulators waveguides and silicon-on-insulator platforms without altering the polymer modulator fabrication process. We achieved power transmission better than-0.2 dB with very good alignment shift tolerance over the whole C-band, by using tapers as short as 179.5 μm.