Title
DIC-IR Analysis of Transient Thermal Stresses
Date Issued
01 January 2021
Access level
metadata only access
Resource Type
conference paper
Author(s)
González J.A.O.
Paiva V.E.L.
Freire J.L.F.
Miskioglu I.
Pontifícia Universidad Católica de Rio de Janeiro
Publisher(s)
Springer
Abstract
This paper shows the feasibility of determining transient thermal strains and stresses using simultaneous time-dependent full-field temperature and displacement measurements along the surface of simple and complex structures. Temperature and displacements were experimentally determined by a set-up composed of a thermographic infrared (IR) micro-bolometer camera coupled to a stereo Digital Image Correlation (DIC) system. A polycarbonate flat disc-shaped specimen was tested under transient thermal inputs. The thermal expansion coefficient of polycarbonate was also measured using the same experimental set up. The mechanical or net strain distributions were determined from the total or gross DIC measured strains by subtracting the free induced temperature strains. The final strain distributions were compared with analytical and finite element solutions determined by using the IR test-measured temperature distributions.
Start page
67
End page
73
Language
English
OCDE Knowledge area
Ingeniería mecánica Ingeniería de materiales
Scopus EID
2-s2.0-85103586651
Source
Conference Proceedings of the Society for Experimental Mechanics Series
ISSN of the container
21915644
ISBN of the container
9783030598631
Conference
SEM Annual Conference and Exposition on Experimental and Applied Mechanics, 2020
Sources of information: Directorio de Producción Científica Scopus