cris.boxmetadata.label.title
Enterprise architecture for credits in the microfinance sector in Peru
cris.boxmetadata.label.dateissued
28 browse.startsWith.months.december 2018
cris.boxmetadata.label.accesslevel
metadata only access
cris.boxmetadata.label.resourcetype
conference paper
cris.boxmetadata.label.authors
cris.boxmetadata.label.publisher
Institute of Electrical and Electronics Engineers Inc.
cris.boxmetadata.label.abstract
The increase of bad debts portfolio of clients is a problem that occurs in companies in the microfinance sector, considered as one of the reasons why many small microfinance institutions go bankrupt and end up transferring their debts to microfinance institutions with greater purchasing power. There are some solutions for the bad debts problem, but they deal more with the economic issue than the technological or business processes, not taking into account the interaction or integration of the main processes of the microfinance, such as the placement of credit products, starting with the design and elaboration of these until collection. This paper proposes a business architecture in response to the bad debts increment. That is why it uses the artifacts of the TOGAF framework, following its ADM methodology for the development of architecture. Likewise, the model of processes proposed in the BIAN standard will be considered to verify its applicability in microfinance institutions when establishing the baseline processes. The result was that the sale of the bad debts was significantly reduced, due to a better control of the process and the use of systems that allow managing and knowing the people who apply for loans, avoiding future indebtedness.
cris.boxmetadata.label.language
Spanish
cris.boxmetadata.label.ocdeknowledgeArea
Negocios, Administración
cris.boxmetadata.label.doi
cris.boxmetadata.label.scopusidentifier
2-s2.0-85061493019
cris.boxmetadata.label.partofresource
Proceedings of the 2018 IEEE 38th Central America and Panama Convention, CONCAPAN 2018
cris.boxmetadata.label.containerisbn
978-153866122-2
cris.boxmetadata.label.conference
018 IEEE 38th Central America and Panama Convention, CONCAPAN 2018
cris.boxmetadata.label.sponsor
Los autores agradecen a la Universidad Peruana de Ciencias aplicadas (UPC) por el financiamiento parcial a la presente investigación.
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