Liquid-phase crystallization (LPC) has proven to be a suitable method to grow large-grained silicon films on commercially well-available glass substrates. Zone-melting crystallization with high-energy-density line sources such as lasers or electron beams enabled polycrystalline grain growth with wafer equivalent morphology. However, the electronic quality is strongly affected by the material used as the interlayer between the glass and the silicon absorber. Open-circuit voltages above 630 mV, and efficiencies up to 11.8% were demonstrated using n-type absorbers on a sputtered interlayer comprising a triple stack of SiO2/SiNx/SiO2. In this study, we present our results to further improve the device performance by investigating the influence of the interlayer on the open-circuit voltage of the devices and characterize the properties of the absorber and interface using bias light-dependent quantum efficiency data and transmission electron microscopy (TEM) images. Finally, we investigate the applicability of aluminum oxide (Al2O3) for passivation of p-type LPC absorbers.