Title
Different thick-film methods in printing of one-electrode semiconductor gas sensors
Date Issued
01 December 1995
Access level
metadata only access
Resource Type
conference paper
Author(s)
Golovanov V.
Lantto V.
Leppavuori S.
Univ of Oulu
Publisher(s)
IEEE
Abstract
Different thick-film printing techniques have been used for the fabrication of one-electrode semiconductor gas sensors in the form of thick films on insulating alumina substrate. In a typical one-electrode sensor construction, a thin platinum wire (φ 20 μ m) spiral is embedded inside a sintered oxide semiconductor bottom. The platinum wire spiral is replaced by a platinum thick-film resistor in our sensor prototype, and the oxide semiconductor is screen printed over the platinum resistor. Both screen printing and gravure offset printing (pad printing) were used for the printing of platinum thick-film resistors. Tin dioxide, an n-type semiconductor, was used as the sensing (shunting) thick-film layer over the platinum resistor, and different amounts of silver and antimony were used as additives in SnO2. H2S and CO at different concentrations in synthetic air were used to test the response properties of two different sensor type with, respectively, screen-printed and pad-printed platinum thick-film resistors.
Start page
874
End page
877
Volume
2
Language
English
OCDE Knowledge area
Física de partículas, Campos de la Física Electroquímica
Scopus EID
2-s2.0-0029490534
Conference
International Conference on Solid-State Sensors and Actuators, and Eurosensors IX, Proceedings
Sources of information: Directorio de Producción Científica Scopus