Title
Relationships of design parameters and the cooling performance of the spiral-fin heatsink
Date Issued
12 May 2021
Access level
metadata only access
Resource Type
conference paper
Author(s)
Waseda University
Publisher(s)
Institute of Electrical and Electronics Engineers Inc.
Abstract
Due to the demand for miniaturization, further improvement in cooling performance is required for power modules. The spiral-fin heatsink we considered has higher cooling performance than conventional ones. In this paper, we examined the design parameters of the spiral-fin, and found that three parameters of spiral-fin have big effect for the cooling performance .
Start page
161
End page
162
Language
English
OCDE Knowledge area
Otras ingenierías y tecnologías
Hardware, Arquitectura de computadoras
Subjects
Scopus EID
2-s2.0-85113315347
ISBN of the container
9784991191114
Conference
2021 International Conference on Electronics Packaging, ICEP 2021
Sponsor(s)
ACKNOWLEDGMENT This work was supported by Council for Science, Technology and Innovation (CSTI), Cross-ministerial Strategic Innovation Promotion Program (SIP), “Energy systems of an Internet of Energy (IoE) society” (Funding agency: JST).
Sources of information:
Directorio de Producción Científica
Scopus