Title
Bandgap engineering of hydrogenated a-SiC:H thin films for photoelectrochemical water splitting applications
Date Issued
15 December 2020
Access level
metadata only access
Resource Type
journal article
Author(s)
Publisher(s)
IOP Publishing Ltd
Abstract
Bandgap engineering of a-SiC:H thin films was carried out to assess the material light absorption without compromising its photoelectrochemical water splitting capabilities. The tailoring was performed by varying the hydrogen concentration in the semiconductor and by post-deposition isochronical annealing treatments from 100 ◦C to 700 ◦C. Bandgap values were obtained by fitting the fundamental absorption region of the absorption coefficient using three different models. Differences among bandgap values extracted by these methods and its correlation with the a-SiC:H structure, demonstrate that structural features, rather than a hydrogen rearrangement or depletion, would be responsible for annealing induced optical bandgap increment. These features are taking in advantage for the bandgap engineering of a-SiC:H without changing Si-C stoichiometry. Optical bandgap values for p-doped a-SiC:H samples gradually increased from 2.59 to 2.76 eV upon performing each annealing step until 600 ◦C. Temperature at which an enhancement in the electric performance is observed. We believe, these results will help on the design of monolithic tandem solar cells for water splitting applications.
Volume
54
Issue
8
Language
English
OCDE Knowledge area
Ingeniería química
Ingeniería eléctrica, Ingeniería electrónica
Electroquímica
Subjects
Publication version
Version of Record
Scopus EID
2-s2.0-85098644807
Source
Journal of Physics D: Applied Physics
ISSN of the container
0022-3727
Sponsor(s)
This research was funded by the peruvian National Fund for Scientific, Technological Development and Technological Innovation (FONDECYT) under the agreement 147-2017-FONDECYT. M Mejia gratefully acknowledges the Peruvian National Council for Science, Technology and Technological Innovation (CONCYTEC) for the PhD scholarship under the grant No. 236-2015-FONDECYT as well as the Pontificia Universidad Católica del Perú (PUCP) vice-chancellorship for research (grant No. CAP-2019-3-0041/702). The authors acknowledge the support of the Materials Characterization Center (CAM-PUCP) and would like to thank the Electrochemistry and Electroplating Group from the Technische Uni-versität Ilmenau, for supporting and helping with contacts deposition and electrical measurements. Finally, the authors are indebted to Alvaro Tejada from PUCP and the Helmholtz Zentrum Berlin for the FESEM measurements.
Sources of information:
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