We have studied the influence of the organic molecule DL-Dithiothreitol on the properties of isotropic conductive adhesives for application in microelectronics. The Ag fillers were prepared from commercial micro flakes or submicron particles from waste jewelry. The results show that coating of the Ag recycled fillers with thiol avoided the agglomeration of the particles improving the dispersion and the electrical and mechanical properties. By comparing the samples, the better properties were obtained from adhesives with recycled Ag particles relative to the ones formulated with commercial Ag flakes and improvement can be attributed to the absence of the lubricant layer and smaller size of the particles produced from recycled silver.