Title
IoT-based temperature monitoring for buildings thermal comfort analysis
Date Issued
01 August 2019
Access level
metadata only access
Resource Type
conference paper
Publisher(s)
Institute of Electrical and Electronics Engineers Inc.
Abstract
In a building, unanticipated and abrupt temperature changes are mainly caused by the characteristics of its architecture: shape, size, number of windows, skylights, etc. This could cause discomfort or health issues to people exposed to its environment. For this reason, this paper presents the development and implementation of a remote temperature measurement system, which collects data inside a building and shows temperature information to any device connected to its local network. This system consists of 4 nodes, each built with an 8- bit microcontroller, a temperature sensor, and a radio frequency transceiver and a main node, based on a Raspberry.
Language
English
OCDE Knowledge area
Ingeniería eléctrica, Ingeniería electrónica
Scopus EID
2-s2.0-85073501495
Resource of which it is part
Proceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019
ISBN of the container
978-172813646-2
Conference
26th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019
Sources of information: Directorio de Producción Científica Scopus