Title
Demonstration of GaN-based metal-insulator-semiconductor junction by hydrogen plasma treatment
Date Issued
03 August 2020
Access level
open access
Resource Type
journal article
Author(s)
Yang C.
Fu H.
Su P.Y.
Liu H.
Fu K.
Huang X.
Yang T.H.
Chen H.
Zhou J.
Deng X.
Montes J.
Qi X.
Zhao Y.
Publisher(s)
American Institute of Physics Inc.
Abstract
We demonstrate a nickel/insulating-GaN (i-GaN)/p-type GaN junction and investigate its electrical properties. The i-GaN is formed by exposure to a low-power hydrogen plasma to passivate the p-GaN layer. Cathodoluminescence spectroscopy of the i-GaN is used to understand the passivation effect of the hydrogen plasma on p-GaN. The junction shows very low leakage (<10-9 A at -50 V), excellent rectifying properties (∼107), high temperature stability, and blue light electroluminescence at forward bias. A bandgap model is proposed to illustrate the electrical properties of hydrogenated p-GaN and to understand the device characteristics.
Volume
117
Issue
5
Language
English
OCDE Knowledge area
FÃsica atómica, molecular y quÃmica
Scopus EID
2-s2.0-85089304262
Source
Applied Physics Letters
ISSN of the container
00036951
Sponsor(s)
This work was supported by the ARPA-E PNDIODES Program monitored by Dr. Isik Kizilyalli and partially supported by the NASA HOTTech Program Grant No. 80NSSC17K0768. The device fabrication was performed at the Center for Solid State Electronics Research at Arizona State University. Access to the NanoFab was supported, in part, by NSF Contract No. ECCS-1542160.
Sources of information:
Directorio de Producción CientÃfica
Scopus