In this work, the fabrication and operation of micro-incandescent lamps is presented. Two types of microlamps are fabricated using micro-cantilevers and micro-bridges of silicon oxynitride (SiOxNy) deposited by Plasma Enhanced Chemical Vapor Deposition (PECVD) at low temperatures (320°C) with embedded chromium thin film resistors. In both cases, the chromium resistor is sandwiched between layers of SiOxNy that isolates it from the atmosphere, while electric current heats the resistor to incandescent temperatures. Front-side bulk micromachining of the silicon substrate in KOH solution is used to fabricate the cantilevers and bridges that thermally isolate the resistors from the substrate, thus reducing the heat transfer and current required to light the lamp. Finally, arrays of bridges are used to fabricate arrays of microlamps that can be polarized as a micro-display. © The Electrochemical Society.